Publication result detail

Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components

Shabanov, N.S.; Rabadanov, K.S.; Suleymanov, S.I.; Amirov, A.M.; Isaev, A.B.; Sobola, D.S.; Murliev, E.K.; Asvarova, G.A.

Original Title

Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components

English Title

Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components

Type

WoS Article

Original Abstract

The aim of this work is preparation and investigation of copper conductive paths by printing with a different type of functional ink. The solutions based on copper-containing complex compounds were used as inks instead of dispersions of metal nanoparticles. Thermal characteristics of synthesized precursors were studied by thermogravimetry in an argon atmosphere. Based on the comparison of decomposition temperature, the dimethylamine complex of copper formate was found to be more suitable precursor for the formation of copper layers. Structure and performance of this compound was studied in detail by X-ray diffraction, test of wettability, printing on flexible substrate, and electrical measurements.

English abstract

The aim of this work is preparation and investigation of copper conductive paths by printing with a different type of functional ink. The solutions based on copper-containing complex compounds were used as inks instead of dispersions of metal nanoparticles. Thermal characteristics of synthesized precursors were studied by thermogravimetry in an argon atmosphere. Based on the comparison of decomposition temperature, the dimethylamine complex of copper formate was found to be more suitable precursor for the formation of copper layers. Structure and performance of this compound was studied in detail by X-ray diffraction, test of wettability, printing on flexible substrate, and electrical measurements.

Keywords

organometallic compound; conductivity; thermogravimetry

Key words in English

organometallic compound; conductivity; thermogravimetry

Authors

Shabanov, N.S.; Rabadanov, K.S.; Suleymanov, S.I.; Amirov, A.M.; Isaev, A.B.; Sobola, D.S.; Murliev, E.K.; Asvarova, G.A.

RIV year

2022

Released

26.04.2021

Publisher

MDPI

Location

BASEL

ISBN

1996-1944

Periodical

Materials

Volume

14

Number

9

State

Swiss Confederation

Pages from

1

Pages to

12

Pages count

12

URL

https://www.mdpi.com/1996-1944/14/9/2218/htm

Full text in the Digital Library

http://hdl.handle.net/11012/203234

BibTex

@article{BUT171356,
  author="Shabanov {Nabi} and Kamil {Rabadanov} and Sagim {Suleimanov} and Akhmed {Amirov} and Abdulgalim {Isaev} and Dinara {Sobola} and Eldar {Murliev} and Gulnara {Asvarova}",
  title="Water-Soluble Copper Ink for the Inkjet Fabrication of Flexible Electronic Components",
  journal="Materials",
  year="2021",
  volume="14",
  number="9",
  pages="1--12",
  doi="10.3390/ma14092218",
  issn="1996-1944",
  url="https://www.mdpi.com/1996-1944/14/9/2218/htm"
}

Documents

materials-14-02218