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LIŠKA, P. NEČASOVÁ, B.
Original Title
The Effect of Technological Indiscipline on the Mechanical Properties of Bonded Joints
Type
conference paper
Language
English
Original Abstract
Increasing requirements on joints in combination with new materials and materials combinations have led to a situation where adhesive bonding becomes the preferred joining method. Adhesive bonding in turn puts high requirements on the users. A research case focused on vented wooden façade systém with bonded joints is presented in this paper. The effect of technological indiscipline on bonded joints is studied and described in more detail and verified through experimental measurements. For the purpose of tests spruce timber profiles were chosen for the load bearing substructure and Siberian larch facade sheeting for the cladding. Polyurethane industrial adhesive intended for structural bonding from Sika Schweiz GmbH was selected. The test results proved the fact that bonded joints are more than suitable equivalent to the mechanical joints. During the tests appeared some differences in stability and failure behaviour between the adhesive systems as well as within the sheeting material. Additionally, the suitability of selected group of adhesives in combination with Siberian larch cladding material as well as with the timber substructure was confirmed.
Keywords
Wooden facade, timber profiles, wooden cladding, adhesive bonded joints, indiscipline
Authors
LIŠKA, P.; NEČASOVÁ, B.
RIV year
2015
Released
29. 1. 2015
Publisher
Vysoké učení technické v Brně, Fakulta stavební
Location
Brno
ISBN
978-80-214-5091-2
Book
Sborník abstraktů Juniorstav 2015
Edition number
1
Pages from
102
Pages to
Pages count
385
BibTex
@inproceedings{BUT112590, author="Pavel {Liška} and Barbora {Nečasová}", title="The Effect of Technological Indiscipline on the Mechanical Properties of Bonded Joints", booktitle="Sborník abstraktů Juniorstav 2015", year="2015", number="1", pages="102--102", publisher="Vysoké učení technické v Brně, Fakulta stavební", address="Brno", isbn="978-80-214-5091-2" }