Publication result detail

Mechanical Stress of Chip SMD Components with Ceramic Body

ŠANDERA, J., HEJÁTKOVÁ, E.

Original Title

Mechanical Stress of Chip SMD Components with Ceramic Body

English Title

Mechanical Stress of Chip SMD Components with Ceramic Body

Type

Paper in proceedings (conference paper)

Original Abstract

The reasons of thermomechanical stress SMD ceramic capacitor soldered on FR4 material are described in this paper. Simulation ANSYS program for FEM analyse is used.

English abstract

The reasons of thermomechanical stress SMD ceramic capacitor soldered on FR4 material are described in this paper. Simulation ANSYS program for FEM analyse is used.

Key words in English

chip ceramic capacitor, package 1206, CTE, ANSYS software

Authors

ŠANDERA, J., HEJÁTKOVÁ, E.

Released

20.09.2003

Location

Brno, University of Technology

ISBN

80-214-2452-4

Book

Electronic Devices and Systems

Pages from

398

Pages count

5

BibTex

@inproceedings{BUT9561,
  author="Josef {Šandera} and Edita {Hejátková}",
  title="Mechanical Stress of Chip SMD Components with Ceramic Body",
  booktitle="Electronic Devices and Systems",
  year="2003",
  pages="5",
  address="Brno, University of Technology",
  isbn="80-214-2452-4"
}