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PSOTA, B.; SZENDIUCH, I.; BURŠÍK, M.
Original Title
Optimization of Wire Loop Formation in Wirebonding Process Using Computer Simulation
English Title
Type
Paper in proceedings (conference paper)
Original Abstract
This paper informs about the simulation of the wirebonding process. We are primary focus on a loop formation and definition of the wire behavior during this process. Simulation model of the bonding structure was created and the definition of the loop shape for different application was gained.
English abstract
Keywords
wirebonding, simulation, ANSYS, FEA, packaging
Key words in English
Authors
RIV year
2013
Released
13.05.2012
Publisher
IEEE Xplore digital library
Location
Vienna University of Technology Gusshausstrasse 27-29 A-1040 WIEN - Austria
ISBN
978-1-4673-2241-6
Book
2012 35th International Spring Seminar on Electronics Technology (ISSE)
2161-2528
Periodical
Conference proceedings (International Spring Seminar on Electronics Technology)
Volume
35
Number
1
State
United States of America
Pages from
282
Pages to
285
Pages count
3
URL
http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6273122&contentType=Conference+Publications&searchField%3DSearch_All%26queryText%3DNic%C3%A1k
BibTex
@inproceedings{BUT93615, author="Boleslav {Psota} and Ivan {Szendiuch} and Martin {Buršík}", title="Optimization of Wire Loop Formation in Wirebonding Process Using Computer Simulation", booktitle="2012 35th International Spring Seminar on Electronics Technology (ISSE)", year="2012", journal="Conference proceedings (International Spring Seminar on Electronics Technology)", volume="35", number="1", pages="282--285", publisher="IEEE Xplore digital library", address="Vienna University of Technology Gusshausstrasse 27-29 A-1040 WIEN - Austria", isbn="978-1-4673-2241-6", issn="2161-2528", url="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6273122&contentType=Conference+Publications&searchField%3DSearch_All%26queryText%3DNic%C3%A1k" }