Publication result detail

Experimental study of glass frit bonding

PEKÁREK, J.; VRBA, R.; PRÁŠEK, J.; CHOMOUCKÁ, J.

Original Title

Experimental study of glass frit bonding

English Title

Experimental study of glass frit bonding

Type

Paper in proceedings (conference paper)

Original Abstract

Glass frit bonding technology provides a wide range of possibilities for the bonding of wafers at process temperatures below 450 C. The process consists of three main steps: screen-printing of the glass paste, thermal conditioning and thermo-compressive bonding. The structured bonding layer protects moveable structures from parasitic bonding. Almost all surface layers commonly used in silicon micromachining can be bonded using glass frits. The main advantages of glass frit bonding are hermetic sealing, high process yield, low mechanical stress at the bonding interface, high bonding strength, and good reliability.

English abstract

Glass frit bonding technology provides a wide range of possibilities for the bonding of wafers at process temperatures below 450 C. The process consists of three main steps: screen-printing of the glass paste, thermal conditioning and thermo-compressive bonding. The structured bonding layer protects moveable structures from parasitic bonding. Almost all surface layers commonly used in silicon micromachining can be bonded using glass frits. The main advantages of glass frit bonding are hermetic sealing, high process yield, low mechanical stress at the bonding interface, high bonding strength, and good reliability.

Keywords

Glass frit, wafer bonding

Key words in English

Glass frit, wafer bonding

Authors

PEKÁREK, J.; VRBA, R.; PRÁŠEK, J.; CHOMOUCKÁ, J.

RIV year

2013

Released

30.05.2012

Publisher

Mendelova univerzita v Brně

Location

Brno

ISBN

978-80-7375-618-5

Book

XII. Pracovní setkání fyzikálních chemiků a elektrochemiků

Pages from

214

Pages to

215

Pages count

2

BibTex

@inproceedings{BUT92579,
  author="Jan {Pekárek} and Radimír {Vrba} and Jan {Prášek} and Jana {Pekárková}",
  title="Experimental study of glass frit bonding",
  booktitle="XII. Pracovní setkání fyzikálních chemiků a elektrochemiků",
  year="2012",
  number="1.",
  pages="214--215",
  publisher="Mendelova univerzita v Brně",
  address="Brno",
  isbn="978-80-7375-618-5"
}