Publication result detail

On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers

NICÁK, M.; ŠANDERA, J.

Original Title

On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers

English Title

On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers

Type

Paper in proceedings (conference paper)

Original Abstract

This paper describes design, construction and some recent tests of three dimensional stacked structures. These structures have great potential to realize compact structures combining multiple different applications in one package. Interconnections used in these structures pay important role in packaging. They not only provide electrical connection, but they also act as mechanical attachment between substrates and are supposed to be reliable. Approach mentioned in this paper might lead to increase of reliability of 3D interconnections. Goal of this work is development and implementation of reliable 3D stacked structures, where LTCC, Al2O3 and also flexible substrates can be connected together in one package by interconnections that are based on vacuum evaporated and galvanically reinforced conductive layers of several types - fixed planar and elastic ones, both in connection with solder balls.

English abstract

This paper describes design, construction and some recent tests of three dimensional stacked structures. These structures have great potential to realize compact structures combining multiple different applications in one package. Interconnections used in these structures pay important role in packaging. They not only provide electrical connection, but they also act as mechanical attachment between substrates and are supposed to be reliable. Approach mentioned in this paper might lead to increase of reliability of 3D interconnections. Goal of this work is development and implementation of reliable 3D stacked structures, where LTCC, Al2O3 and also flexible substrates can be connected together in one package by interconnections that are based on vacuum evaporated and galvanically reinforced conductive layers of several types - fixed planar and elastic ones, both in connection with solder balls.

Keywords

3D structures, LTCC, vacuum evaporation, galvanic processes

Key words in English

3D structures, LTCC, vacuum evaporation, galvanic processes

Authors

NICÁK, M.; ŠANDERA, J.

RIV year

2012

Released

11.05.2011

Publisher

Technická Univerzita Košice

Location

Košice, SK

ISBN

978-1-4577-2111-3

Book

ISSE 2011 - PROCEEDINGS

Edition

1.

ISBN

2161-2528

Periodical

Conference proceedings (International Spring Seminar on Electronics Technology)

Volume

34

State

United States of America

Pages from

109

Pages to

111

Pages count

3

URL

http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560

BibTex

@inproceedings{BUT73390,
  author="Michal {Nicák} and Josef {Šandera}",
  title="On the Application of 3D LTCC and Flexible Structures Based on Galvanized Layers",
  booktitle="ISSE 2011 - PROCEEDINGS",
  year="2011",
  series="1.",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  volume="34",
  number="1",
  pages="109--111",
  publisher="Technická Univerzita Košice",
  address="Košice, SK",
  isbn="978-1-4577-2111-3",
  issn="2161-2528",
  url="http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053560"
}