Publication result detail

Modeling of Microelectronic Structures and Packages using ANSYS Software

PSOTA, B.; SZENDIUCH, I.

Original Title

Modeling of Microelectronic Structures and Packages using ANSYS Software

English Title

Modeling of Microelectronic Structures and Packages using ANSYS Software

Type

Conference proceedings

Original Abstract

This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.

English abstract

This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.

Keywords

Mechanical stress, ANSYS, BGA, Simulation

Key words in English

Mechanical stress, ANSYS, BGA, Simulation

Authors

PSOTA, B.; SZENDIUCH, I.

RIV year

2012

Released

16.05.2011

ISBN

978-1-4577-2111-3

BibTex

@proceedings{BUT73010,
  editor="Boleslav {Psota} and Ivan {Szendiuch}",
  title="Modeling of Microelectronic Structures and Packages using ANSYS Software",
  year="2011",
  isbn="978-1-4577-2111-3"
}