Result with impact on practice detail

To the Lead free Soldering Application Process

SZENDIUCH, I., STARÝ, J.

Original Title

To the Lead free Soldering Application Process

English Title

To the Lead free Soldering Application Process

Type

Audiovisual work

Original Abstract

Přednáška pojednává o problematice procesu bezolovnatého pájení

English abstract

Presentation of lead free soldering process

Keywords

bezolovnaté pájky, pájení

Key words in English

lead free, soldering

Authors

SZENDIUCH, I., STARÝ, J.

Released

20.01.2004

Publisher

IMAPS

Location

Lanškroun

Book

International Microelectronics and Packaging Society Workshop

Volume

2004

Pages from

1

Pages count

25

BibTex

@misc{BUT63318,
  author="Ivan {Szendiuch} and Jiří {Starý}",
  title="To the Lead free Soldering Application Process",
  booktitle="International Microelectronics and Packaging Society Workshop",
  year="2004",
  volume="2004",
  pages="25",
  publisher="IMAPS",
  address="Lanškroun",
  note="Audiovisual work"
}