Publication result detail

Influence of the CTE on Mechanical Stress of Chip SMD Components

ŠANDERA, J., HEJÁTKOVÁ, E.

Original Title

Influence of the CTE on Mechanical Stress of Chip SMD Components

English Title

Influence of the CTE on Mechanical Stress of Chip SMD Components

Type

Paper in proceedings (conference paper)

Original Abstract

This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used.

English abstract

This paper describes the reasons of mechanical stress of SMD chip components soldered on FR4 substrate caused by thermal changes on board. There is especially presented a simulation of mechanical stress in volume ceramic capacitor body in 1206 package. Simulation ANSYS program for finite element analysis and design is used.

Keywords

SMT, Chip Component, Coefficient of Thermal Expansion, Effective Stress, ANSYS simulation software, 1206 chip component

Key words in English

SMT, Chip Component, Coefficient of Thermal Expansion, Effective Stress, ANSYS simulation software, 1206 chip component

Authors

ŠANDERA, J., HEJÁTKOVÁ, E.

Released

01.01.2002

Location

Brno

ISBN

80-214-2217-3

Book

Socrates Workshop 2002 - Proceedings

Pages from

92

Pages count

5

BibTex

@inproceedings{BUT5119,
  author="Josef {Šandera} and Edita {Hejátková}",
  title="Influence of the CTE on Mechanical Stress of Chip SMD Components",
  booktitle="Socrates Workshop 2002 - Proceedings",
  year="2002",
  number="1.",
  pages="5",
  address="Brno",
  isbn="80-214-2217-3"
}