Publication result detail

MSM System in Package - One Way to System Integration

SZENDIUCH, I.

Original Title

MSM System in Package - One Way to System Integration

English Title

MSM System in Package - One Way to System Integration

Type

Paper in proceedings (conference paper)

Original Abstract

The stacked packages are one of the most significant advances for building modern electronic systems. They give a good oportunity to built a high volume 3D devices with requested quality.

English abstract

The stacked packages are one of the most significant advances for building modern electronic systems. They give a good oportunity to built a high volume 3D devices with requested quality.

Keywords

MSM, SOC, CSP, SIP

Key words in English

MSM, SOC, CSP, SIP

Authors

SZENDIUCH, I.

Released

01.05.2002

Publisher

TYPOS-Digital Print

Location

Praha

ISBN

0-7803-9824-6

Book

ISSE 2002

Pages from

266

Pages count

3

BibTex

@inproceedings{BUT4778,
  author="Ivan {Szendiuch}",
  title="MSM System in Package - One Way to System Integration",
  booktitle="ISSE 2002",
  year="2002",
  number="1",
  pages="3",
  publisher="TYPOS-Digital Print",
  address="Praha",
  isbn="0-7803-9824-6"
}