Publication result detail

Phase Change Materials for Thermal Management of IC Packages

FIALA, P.; BĚHUNEK, I.

Original Title

Phase Change Materials for Thermal Management of IC Packages

English Title

Phase Change Materials for Thermal Management of IC Packages

Type

Peer-reviewed article not indexed in WoS or Scopus

Original Abstract

This paper deals with the application of phase change materials (PCM) for thermal management of inte-grated circuits as a viable alternative to active forced con-vection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of a real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.

English abstract

This paper deals with the application of phase change materials (PCM) for thermal management of inte-grated circuits as a viable alternative to active forced con-vection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of a real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.

Keywords

Phase change, FEM, heat, integrated circuit.

Key words in English

Phase change, FEM, heat, integrated circuit.

Authors

FIALA, P.; BĚHUNEK, I.

RIV year

2010

Released

01.06.2007

Publisher

VUT - FEKT, Dept. of Radio Electronics

Location

Purkyňova 118, 61200 Brno

ISBN

1210-2512

Periodical

Radioengineering

Volume

2007 (16)

Number

2

State

Czech Republic

Pages from

50

Pages to

55

Pages count

6

URL

http://www.radioeng.cz

BibTex

@article{BUT44299,
  author="Pavel {Fiala} and Ivo {Běhunek}",
  title="Phase Change Materials for Thermal Management of IC Packages",
  journal="Radioengineering",
  year="2007",
  volume="2007 (16)",
  number="2",
  pages="50--55",
  issn="1210-2512",
  url="http://www.radioeng.cz"
}