Publication result detail

Trends in Packaging and Lead-free Solders

SZENDIUCH, I.

Original Title

Trends in Packaging and Lead-free Solders

English Title

Trends in Packaging and Lead-free Solders

Type

Peer-reviewed article not indexed in WoS or Scopus

Original Abstract

Modern Trend in Packaging with application of Pb-free solders are described in this paper

English abstract

Modern Trend in Packaging with application of Pb-free solders are described in this paper

Keywords

Packaging and Interconnectin, Lead-free soldering

Key words in English

Packaging and Interconnectin, Lead-free soldering

Authors

SZENDIUCH, I.

Released

22.10.2003

Publisher

SMT info konsorcium

Location

Brno

Book

SDMT info Bulletin

Edition

43/2003

ISBN

1211-6947

Periodical

Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics"

Volume

2003

Number

43

State

Czech Republic

Pages from

3

Pages count

4

BibTex

@article{BUT41776,
  author="Ivan {Szendiuch}",
  title="Trends in Packaging and Lead-free Solders",
  journal="Bulletin of SMT/ISHM Int. Conference {"}New Trends in Microelectronics{"}",
  year="2003",
  volume="2003",
  number="43",
  pages="4",
  issn="1211-6947"
}