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SZENDIUCH, I.
Original Title
Trends in Packaging and Lead-free Solders
English Title
Type
Peer-reviewed article not indexed in WoS or Scopus
Original Abstract
Modern Trend in Packaging with application of Pb-free solders are described in this paper
English abstract
Keywords
Packaging and Interconnectin, Lead-free soldering
Key words in English
Authors
Released
22.10.2003
Publisher
SMT info konsorcium
Location
Brno
Book
SDMT info Bulletin
Edition
43/2003
ISBN
1211-6947
Periodical
Bulletin of SMT/ISHM Int. Conference "New Trends in Microelectronics"
Volume
2003
Number
43
State
Czech Republic
Pages from
3
Pages count
4
BibTex
@article{BUT41776, author="Ivan {Szendiuch}", title="Trends in Packaging and Lead-free Solders", journal="Bulletin of SMT/ISHM Int. Conference {"}New Trends in Microelectronics{"}", year="2003", volume="2003", number="43", pages="4", issn="1211-6947" }