Publication result detail

Wafer-level packaging vs. chip-level Packaging

SZENDIUCH, I.

Original Title

Wafer-level packaging vs. chip-level Packaging

English Title

Wafer-level packaging vs. chip-level Packaging

Type

Paper in proceedings (conference paper)

Original Abstract

see paper

English abstract

see paper

Key words in English

wafer-level packaging, bump, flip-chip

Authors

SZENDIUCH, I.

Released

01.01.2001

Publisher

Ing. Zdeněk Novotný

Location

Brno

Book

Intensive Training Programme in Electronic System Design, Proceedings

Pages from

54

Pages count

5

BibTex

@inproceedings{BUT3727,
  author="Ivan {Szendiuch}",
  title="Wafer-level packaging vs. chip-level Packaging",
  booktitle="Intensive Training Programme in Electronic System Design, Proceedings",
  year="2001",
  pages="5",
  publisher="Ing. Zdeněk Novotný",
  address="Brno"
}