Detail publikačního výsledku

New Facts from Lead-free Solders Reliability Investigation

BURŠÍK, M.; SZENDIUCH, I.; JANKOVSKÝ, J.; HEJÁTKOVÁ, E.

Original Title

New Facts from Lead-free Solders Reliability Investigation

English Title

New Facts from Lead-free Solders Reliability Investigation

Type

Paper in proceedings (conference paper)

Original Abstract

The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.

English abstract

The aim is to investigate some factors which influencing solder joint reliability and voids restriction, especially by reflow soldering process. The core factor for prediction and evaluation of solder joint reliability is solder joint structure.

Keywords

Lead-free, reliability, solder, structure

Key words in English

Lead-free, reliability, solder, structure

Authors

BURŠÍK, M.; SZENDIUCH, I.; JANKOVSKÝ, J.; HEJÁTKOVÁ, E.

RIV year

2011

Released

13.09.2010

Location

Berlín, Německo

ISBN

978-1-4244-8555-0

Book

Electronics System Integration Technology Conference ESTC 2010 in Berlin

Edition

1

Pages from

101

Pages to

105

Pages count

5

Full text in the Digital Library

http://hdl.handle.net/

BibTex

@inproceedings{BUT35244,
  author="Martin {Buršík} and Ivan {Szendiuch} and Jaroslav {Jankovský} and Edita {Hejátková}",
  title="New Facts from Lead-free Solders Reliability Investigation",
  booktitle="Electronics System Integration Technology Conference ESTC 2010 in Berlin",
  year="2010",
  series="1",
  number="1",
  pages="101--105",
  address="Berlín, Německo",
  isbn="978-1-4244-8555-0"
}