Publication result detail

Testing and Simulation of Wire Bonding Attach for higher Current

BURŠÍK, M.; NOVOTNÝ, M.; JANKOVSKÝ, J.; HEJÁTKOVÁ, E.; SZENDIUCH, I.

Original Title

Testing and Simulation of Wire Bonding Attach for higher Current

English Title

Testing and Simulation of Wire Bonding Attach for higher Current

Type

Paper in proceedings (conference paper)

Original Abstract

This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for standard CMOS technology.

English abstract

This paper describes some results obtained during our research work concerning development of the test equipment for high current stress measurement, for standard CMOS technology.

Keywords

Testing, current load, wire bonding, simulation

Key words in English

Testing, current load, wire bonding, simulation

Authors

BURŠÍK, M.; NOVOTNÝ, M.; JANKOVSKÝ, J.; HEJÁTKOVÁ, E.; SZENDIUCH, I.

RIV year

2011

Released

13.09.2010

Location

Berlín, Německo

ISBN

978-1-4244-8555-0

Book

Electronics System Integration Technology Conference ESTC 2010 in Berlin

Edition

1

Pages from

1

Pages to

4

Pages count

4

BibTex

@inproceedings{BUT35243,
  author="Martin {Buršík} and Marek {Novotný} and Jaroslav {Jankovský} and Edita {Hejátková} and Ivan {Szendiuch}",
  title="Testing and Simulation of Wire Bonding Attach for higher Current",
  booktitle="Electronics System Integration Technology Conference ESTC 2010 in Berlin",
  year="2010",
  series="1",
  number="1",
  pages="1--4",
  address="Berlín, Německo",
  isbn="978-1-4244-8555-0"
}