Publication result detail

Levné 3-D pouzdření a multimodulové struktury

ŠANDERA, J., HEJÁTKOVÁ, E.

Original Title

Levné 3-D pouzdření a multimodulové struktury

English Title

Cheap 3-D Packaging and Multimodule Structures

Type

Paper in proceedings (conference paper)

Original Abstract

Since development of integrated circuit it has been known, that drastically increases number of leads, because it's structure is more complicated. Finally 3-D (three- dimension) technique permits by passing barrier of 100% of the efficiency of packaging. The research of this problem and especially low cost solution, seems to be very interesting a significant.

English abstract

Since development of integrated circuit it has been known, that drastically increases number of leads, because it's structure is more complicated. Finally 3-D (three- dimension) technique permits by passing barrier of 100% of the efficiency of packaging. The research of this problem and especially low cost solution, seems to be very interesting a significant.

Key words in English

3-D structures, packaging efficiency, multimodule, ball-terminal, edge-terminal

Authors

ŠANDERA, J., HEJÁTKOVÁ, E.

Released

01.01.2001

Publisher

Ing. Zdeněk Novotný, CSc, Brno, Ondráčkova 105

Location

Brno

ISBN

80-214-1960-1

Book

8th Electronic Devices and Systems Conference 2001

Pages from

199

Pages to

204

Pages count

5

BibTex

@inproceedings{BUT3338,
  author="Josef {Šandera} and Edita {Hejátková}",
  title="Levné 3-D pouzdření a multimodulové struktury",
  booktitle="8th Electronic Devices and Systems Conference 2001",
  year="2001",
  pages="199--204",
  publisher="Ing. Zdeněk Novotný, CSc, Brno, Ondráčkova 105",
  address="Brno",
  isbn="80-214-1960-1"
}