Publication result detail

Combined methods for processor cooling, phase Change Materials for Thermal Management of IC Packages

BĚHUNEK, I.; FIALA, P.

Original Title

Combined methods for processor cooling, phase Change Materials for Thermal Management of IC Packages

English Title

Combined methods for processor cooling, phase Change Materials for Thermal Management of IC Packages

Type

Paper in proceedings (conference paper)

Original Abstract

This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.

English abstract

This paper deals with the application of phase change materials (PCM) for thermal management of integrated circuits as a viable alternative to active forced convection cooling systems. The paper presents an analytical description and solution of heat transfer, melting and freezing process in 1D which is applied to inorganic crystalline salts. There are also results of numerical simulation of real 3D model. These results were obtained by means of the finite element method (FEM). Results of 3D numerical solutions were verified experimentally.

Keywords

FEM, ANSYS, phase change, cooling, thermal management

Key words in English

FEM, ANSYS, phase change, cooling, thermal management

Authors

BĚHUNEK, I.; FIALA, P.

Released

05.10.2007

Location

Lednice

ISBN

978-80-254-0301-3

Book

15. Ansys Users Meeting

Pages from

1

Pages to

12

Pages count

12

BibTex

@inproceedings{BUT25600,
  author="Ivo {Běhunek} and Pavel {Fiala}",
  title="Combined methods for processor cooling, phase Change Materials for Thermal Management of IC Packages",
  booktitle="15. Ansys Users Meeting",
  year="2007",
  pages="1--12",
  address="Lednice",
  isbn="978-80-254-0301-3"
}