Publication result detail

Measuring Thermomechanical Reliability of Solder Joint in Electronic

ŠANDERA, J.

Original Title

Measuring Thermomechanical Reliability of Solder Joint in Electronic

English Title

Measuring Thermomechanical Reliability of Solder Joint in Electronic

Type

Paper in proceedings (conference paper)

Original Abstract

Methodology of measure thermomechanical reliability of the solder joint is presented. original electrical method of measure mechanical crack in system follous.

English abstract

Methodology of measure thermomechanical reliability of the solder joint is presented. original electrical method of measure mechanical crack in system follous.

Keywords

reliability, solder joint, electronic

Key words in English

reliability, solder joint, electronic

Authors

ŠANDERA, J.

Released

14.06.2006

Publisher

Zdeněk Novotný, Brno, Ondráčkova 105

Location

Brno

ISBN

80-214-3246-2

Book

EDS06 Imaps CS International Conference Proceedings

Pages from

281

Pages count

4

BibTex

@inproceedings{BUT25137,
  author="Josef {Šandera}",
  title="Measuring Thermomechanical Reliability of Solder Joint in Electronic",
  booktitle="EDS06 Imaps CS International Conference Proceedings",
  year="2006",
  number="1. vydání",
  pages="4",
  publisher="Zdeněk Novotný, Brno, Ondráčkova 105",
  address="Brno",
  isbn="80-214-3246-2"
}