Detail publikačního výsledku

Simulation of different substrates connection

Novotný, M., Szendiuch, I.

Original Title

Simulation of different substrates connection

English Title

Simulation of different substrates connection

Type

Paper in proceedings (conference paper)

Original Abstract

This paper describes recent developments made to the finite element modeling of substrates interconnection, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of different substrates.

English abstract

This paper describes recent developments made to the finite element modeling of substrates interconnection, extending its capability to handle viscoplastic behavior. It also presents the validation of this approach and results obtained for an interconnection of different substrates.

Key words in English

Stress, interconnection, ANSYS

Authors

Novotný, M., Szendiuch, I.

Released

01.01.2006

Publisher

VUT Brno

Location

Brno

ISBN

80-214-3246-2

Book

Proceedings EDS '06

Pages from

499

Pages count

5

Full text in the Digital Library

http://hdl.handle.net/

BibTex

@inproceedings{BUT24669,
  author="Marek {Novotný} and Ivan {Szendiuch}",
  title="Simulation of different substrates connection",
  booktitle="Proceedings EDS '06",
  year="2006",
  number="první",
  pages="5",
  publisher="VUT Brno",
  address="Brno",
  isbn="80-214-3246-2"
}