Publication result detail

New approach to non-destructive testing of conductive materials

DĚDKOVÁ, J.; STEINBAUER, M.

Original Title

New approach to non-destructive testing of conductive materials

English Title

New approach to non-destructive testing of conductive materials

Type

Paper in proceedings (conference paper)

Original Abstract

In this paper we propose new approach for recovering conductivity distribution using electric impedance tomography. The reconstruction process is an ill-posed inverse problem. There is presented that new algorithm based on stochastic methods is suitable for the reconstruction of conductivity distribution and non-destructive detection of some cracks in conductive materials. There are compared the numerical results obtained using new algorithms and using widely known Tikhonov regularization method.

English abstract

In this paper we propose new approach for recovering conductivity distribution using electric impedance tomography. The reconstruction process is an ill-posed inverse problem. There is presented that new algorithm based on stochastic methods is suitable for the reconstruction of conductivity distribution and non-destructive detection of some cracks in conductive materials. There are compared the numerical results obtained using new algorithms and using widely known Tikhonov regularization method.

Keywords

recovering conductivity distribution, electric impedance tomography

Key words in English

recovering conductivity distribution, electric impedance tomography

Authors

DĚDKOVÁ, J.; STEINBAUER, M.

Released

13.09.2007

Publisher

Czech Technical University

Location

Czech Republic Praha

ISBN

978-80-01-03784-3

Book

ISEF'2007 BOOK OF DIGESTS

Pages from

499

Pages to

504

Pages count

6

BibTex

@inproceedings{BUT23548,
  author="Jarmila {Dědková} and Miloslav {Steinbauer}",
  title="New approach to non-destructive testing of conductive materials",
  booktitle="ISEF'2007 BOOK OF DIGESTS",
  year="2007",
  pages="499--504",
  publisher="Czech Technical University",
  address="Czech Republic
Praha",
  isbn="978-80-01-03784-3"
}