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KOPŘIVA, P.; OTÁHAL, A.
Original Title
Design of a device for measuring the electrical resistance of soldered joints during fatigue tests
English Title
Type
Paper in proceedings (conference paper)
Original Abstract
This document deals with design of device capable of measuring electrical resistance of solder joints during fatigue testing. It contains theory behind fatigue testing, chosen parameters, design, and construction of the measuring device.
English abstract
Keywords
BGA package, Design, DPS, Fatigue tests, joints, Resistance measurement, Solder
Key words in English
Authors
Released
23.04.2024
Publisher
Brno University of Technology, Faculty of Electrical Engineering and Communication
Location
Brno
ISBN
978-80-214-6231-1
Book
Proceedings II of the 30th Conference STUDENT EEICT 2024 Selected papers
Edition
1
Pages from
155
Pages to
158
Pages count
4
URL
https://www.eeict.cz/eeict_download/archiv/sborniky/EEICT_2024_sbornik_1.pdf
BibTex
@inproceedings{BUT198185, author="Pavel {Kopřiva} and Alexandr {Otáhal}", title="Design of a device for measuring the electrical resistance of soldered joints during fatigue tests", booktitle="Proceedings II of the 30th Conference STUDENT EEICT 2024 Selected papers", year="2024", series="1", pages="155--158", publisher="Brno University of Technology, Faculty of Electrical Engineering and Communication", address="Brno", isbn="978-80-214-6231-1", url="https://www.eeict.cz/eeict_download/archiv/sborniky/EEICT_2024_sbornik_1.pdf" }