Publication result detail

Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method

KARIMI-SIBAKI, E.; VAKHRUSHEV, A.; WU, M.; LUDWIG, A.; BOHÁČEK, J.; KHARICHA, A.

Original Title

Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method

English Title

Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method

Type

WoS Article

Original Abstract

A numerical model utilizing the volume of fluid (VOF) method is proposed to simulate the transient shape changes of the deposit front, considering the diffusion-limited electrodeposition process. Modeling equations are proposed to accurately handle transport phenomena in both electrolyte (fluid) and deposit (solid). Transient evolutions of field structures, including flow, concentration, electric current density, and electric potential, are computed considering electrodeposited copper bumps. Two cases, including single cavity and multiple cavities, are studied. Based on the modeling results, the maximum height of the hump and the thickness of the deposited layer in each consecutive cavity decreases going from upstream to downstream. Conversely, the location of the maximum height of the hump remains unchanged in all cavities. Results are validated against available experiments.

English abstract

A numerical model utilizing the volume of fluid (VOF) method is proposed to simulate the transient shape changes of the deposit front, considering the diffusion-limited electrodeposition process. Modeling equations are proposed to accurately handle transport phenomena in both electrolyte (fluid) and deposit (solid). Transient evolutions of field structures, including flow, concentration, electric current density, and electric potential, are computed considering electrodeposited copper bumps. Two cases, including single cavity and multiple cavities, are studied. Based on the modeling results, the maximum height of the hump and the thickness of the deposited layer in each consecutive cavity decreases going from upstream to downstream. Conversely, the location of the maximum height of the hump remains unchanged in all cavities. Results are validated against available experiments.

Keywords

SHAPE EVOLUTION; COPPER; DEPOSITION; BUMPS; MODEL

Key words in English

SHAPE EVOLUTION; COPPER; DEPOSITION; BUMPS; MODEL

Authors

KARIMI-SIBAKI, E.; VAKHRUSHEV, A.; WU, M.; LUDWIG, A.; BOHÁČEK, J.; KHARICHA, A.

RIV year

2024

Released

04.07.2023

Publisher

ELECTROCHEMICAL SOC INC

Location

PENNINGTON

ISBN

0013-4651

Periodical

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Volume

170

Number

7

State

United States of America

Pages from

1

Pages to

6

Pages count

6

URL

https://iopscience.iop.org/article/10.1149/1945-7111/ace133

Full text in the Digital Library

http://hdl.handle.net/11012/244991

BibTex

@article{BUT184760,
  author="Ebrahim {Karimi-Sibaki} and Alexander {Vakhrushev} and Menghuai {Wu} and Andreas {Ludwig} and Jan {Boháček} and Abdellah {Kharicha}",
  title="Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method",
  journal="JOURNAL OF THE ELECTROCHEMICAL SOCIETY",
  year="2023",
  volume="170",
  number="7",
  pages="1--6",
  doi="10.1149/1945-7111/ace133",
  issn="0013-4651",
  url="https://iopscience.iop.org/article/10.1149/1945-7111/ace133"
}

Documents

Karimi-Sibaki_2023_J._Electrochem._Soc._170_072501