Publication detail

Pairing Laser Ablation and Xe Plasma FIB-SEM: An approach for precise endpointing in large-scale Physical Failure Analysis in the Semiconductor Industry

DELGADILLO BLANDO, R. HLADÍK, L. OBONA, J. BORŮVKA, T. BÚRAN, M. KRAUSE, M. ROTTWINKEL, B. FULLER, S.

Original Title

Pairing Laser Ablation and Xe Plasma FIB-SEM: An approach for precise endpointing in large-scale Physical Failure Analysis in the Semiconductor Industry

Type

article in a collection out of WoS and Scopus

Language

English

Original Abstract

In this work we present a large-volume workflow for fast failure analysis of microelectronic devices that combines a stand-alone ps-laser ablation tool with a SEM/Xe Plasma FIB system. In this synergy, the ps-laser is used to quickly remove large volumes of bulk material while the SEM/Xe Plasma FIB is used for precise end-pointing to the feature of interest and fine surface polishing after laser. The concept of having a standalone laser tool obeys the logic of maximizing productivity as both systems can work simultaneously and continuously. As application examples we first present a full workflow to prepare an artefact-free, delamination-free cross-section in an AMOLED mobile display. We also present applications examples that require cm-sized long cuts to cut through whole microelectronic devices, or removal of cubic-mm of material to prepare mm-sized cross-sections in packages. We discuss a way how to implement correlation data across the laser and FIBSEM platforms through SYNOPSYS Avalon SW allowing precise navigation to the area of interest using layout circuit overlays. We also show an example of image bitmap overlay to navigate across platforms and end-pointing.

Keywords

failure analysis, focused ion beam, laser ablation, microelectronic devices, picosecond laser, scanning electron microscopy, surface polishing, xenon plasma focused ion beam

Authors

DELGADILLO BLANDO, R.; HLADÍK, L.; OBONA, J.; BORŮVKA, T.; BÚRAN, M.; KRAUSE, M.; ROTTWINKEL, B.; FULLER, S.

Released

31. 10. 2021

Publisher

ASM International

Location

Phoenix, Arizona, USA

Pages from

283

Pages to

290

Pages count

8

URL

https://watermark.silverchair.com/istfa2021p0283.pdf?token=AQECAHi208BE49Ooan9kkhW_Ercy7Dm3ZL_9Cf3qfKAc485ysgAAA9swggPXBgkqhkiG9w0BBwagggPIMIIDxAIBADCCA70GCSqGSIb3DQEHATAeBglghkgBZQMEAS4wEQQM0HKzpw3lkppdn6qNAgEQgIIDjrgiClgGqXxh8-z0v_a2YSNRtMjM86UtqfLCAFkg-wGbFi_b2KULPV3NkznHVflqYNMSEFbStKXfIUgHFBDdoH1T8XDtIFpKDvBDU2xnKJVi3cpviSbCglYTMkua8H5AxJD7nxlMtThq2lf_OltJRjC64G-rCZDiWhPMpHWzmeuwwpqXhGgiDBmNwwc3kvu8FEbRaQih9NIkBSJlwzCSI5uhdbzEUSimYXtJu3nL1gGfAFyQcjlU3DgkRnOriJPyvqSqcVpKcm9TO_5DA2AWmTRufBcDvc5ebCi3W-vJm

BibTex

@inproceedings{BUT175371,
  author="Rodrigo {Delgadillo Blando} and Lukáš {Hladík} and Jozef Vincenc {Obona} and Tomáš {Borůvka} and Martin {Búran} and Michael {Krause} and Boris Arnold {Rottwinkel} and Scott {Fuller}",
  title="Pairing Laser Ablation and Xe Plasma FIB-SEM: An approach for precise endpointing in large-scale Physical Failure Analysis in the Semiconductor Industry",
  booktitle="ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis",
  year="2021",
  series="1",
  pages="283--290",
  publisher="ASM International",
  address="Phoenix, Arizona, USA",
  doi="10.31399/asm.cp.istfa2021p0283",
  url="https://watermark.silverchair.com/istfa2021p0283.pdf?token=AQECAHi208BE49Ooan9kkhW_Ercy7Dm3ZL_9Cf3qfKAc485ysgAAA9swggPXBgkqhkiG9w0BBwagggPIMIIDxAIBADCCA70GCSqGSIb3DQEHATAeBglghkgBZQMEAS4wEQQM0HKzpw3lkppdn6qNAgEQgIIDjrgiClgGqXxh8-z0v_a2YSNRtMjM86UtqfLCAFkg-wGbFi_b2KULPV3NkznHVflqYNMSEFbStKXfIUgHFBDdoH1T8XDtIFpKDvBDU2xnKJVi3cpviSbCglYTMkua8H5AxJD7nxlMtThq2lf_OltJRjC64G-rCZDiWhPMpHWzmeuwwpqXhGgiDBmNwwc3kvu8FEbRaQih9NIkBSJlwzCSI5uhdbzEUSimYXtJu3nL1gGfAFyQcjlU3DgkRnOriJPyvqSqcVpKcm9TO_5DA2AWmTRufBcDvc5ebCi3W-vJm"
}