Publication result detail

Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure

OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.; BÚRAN, M.

Original Title

Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure

English Title

Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure

Type

Paper in proceedings (conference paper)

Original Abstract

This article deals with the possibilities of representing the detail of solder ball inner structure more precisely using two methods of sample preparation. The first method of sample preparation is standard metallographic microsection with grinding and polishing with diamond paste with a grain size up to 0.25 μm. The second method is the microsection of the BGA (ball grid array) ball using FIB (focused ion beam) technology. Both technologies contain disadvantages in examining the detail of the solder structure. Scratches are a common problem for grinding and polishing which are caused by the smallest grain in the polishing paste. The FIB technology is designed for a smaller sample rather than a BGA ball. Using this technology, the curtain can be caused by an ion beam. This research is mainly concerned with the comparison of these technologies with emphasis on the possibility of losing information when processing samples.

English abstract

This article deals with the possibilities of representing the detail of solder ball inner structure more precisely using two methods of sample preparation. The first method of sample preparation is standard metallographic microsection with grinding and polishing with diamond paste with a grain size up to 0.25 μm. The second method is the microsection of the BGA (ball grid array) ball using FIB (focused ion beam) technology. Both technologies contain disadvantages in examining the detail of the solder structure. Scratches are a common problem for grinding and polishing which are caused by the smallest grain in the polishing paste. The FIB technology is designed for a smaller sample rather than a BGA ball. Using this technology, the curtain can be caused by an ion beam. This research is mainly concerned with the comparison of these technologies with emphasis on the possibility of losing information when processing samples.

Keywords

ball grid arrays, focused ion beam technology, grain size, grinding, metallography, polishing, solders

Key words in English

ball grid arrays, focused ion beam technology, grain size, grinding, metallography, polishing, solders

Authors

OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.; BÚRAN, M.

RIV year

2022

Released

01.07.2021

Publisher

IEEE

ISBN

978-1-6654-1477-7

Book

2021 44th International Spring Seminar on Electronics Technology (ISSE)

ISBN

2161-2536

Periodical

Conference proceedings (International Spring Seminar on Electronics Technology)

Volume

44

Number

1

State

United States of America

Pages from

1

Pages to

6

Pages count

6

URL

https://ieeexplore.ieee.org/document/9467519

BibTex

@inproceedings{BUT172578,
  author="Alexandr {Otáhal} and Josef {Skácel} and Ivan {Szendiuch} and Martin {Búran}",
  title="Comparison of Sample Preparation with Microsection and FIB Depending on the Detail of Structure",
  booktitle="2021 44th International Spring Seminar on Electronics Technology (ISSE)",
  year="2021",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  volume="44",
  number="1",
  pages="1--6",
  publisher="IEEE",
  doi="10.1109/ISSE51996.2021.9467626",
  isbn="978-1-6654-1477-7",
  url="https://ieeexplore.ieee.org/document/9467519"
}