Publication result detail

Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages

OTÁHAL, A.; ŘEZNÍČEK, M.; SKÁCEL, J.

Original Title

Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages

English Title

Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages

Type

Paper in proceedings (conference paper)

Original Abstract

This paper is focused on evaluation of influence of flux residues encapsulated under underfill of BGA package on failure, area size and circularity of solder balls interconnection after rework and repair process. The main goal of the work was to find out whether there will be a larger number of failures for washed or unwashed underfilled BGA packages after second reflow soldering process. Repeated cycle of reflow soldering simulated rework and repair process heat stress for neighboring devices with underfill. Results of this investigation were number of failures and failure modes of solder joints of BGA package.

English abstract

This paper is focused on evaluation of influence of flux residues encapsulated under underfill of BGA package on failure, area size and circularity of solder balls interconnection after rework and repair process. The main goal of the work was to find out whether there will be a larger number of failures for washed or unwashed underfilled BGA packages after second reflow soldering process. Repeated cycle of reflow soldering simulated rework and repair process heat stress for neighboring devices with underfill. Results of this investigation were number of failures and failure modes of solder joints of BGA package.

Keywords

ball grid arrays, circuit reliability, reflow soldering, soldering, solders, thermal stresses, tin alloys

Key words in English

ball grid arrays, circuit reliability, reflow soldering, soldering, solders, thermal stresses, tin alloys

Authors

OTÁHAL, A.; ŘEZNÍČEK, M.; SKÁCEL, J.

RIV year

2022

Released

01.07.2021

Publisher

IEEE

ISBN

978-1-6654-1477-7

Book

2021 44th International Spring Seminar on Electronics Technology (ISSE)

ISBN

2161-2536

Periodical

Conference proceedings (International Spring Seminar on Electronics Technology)

Volume

44

Number

1

State

United States of America

Pages from

1

Pages to

4

Pages count

4

URL

https://ieeexplore.ieee.org/document/9467519

BibTex

@inproceedings{BUT172557,
  author="Alexandr {Otáhal} and Michal {Řezníček} and Josef {Skácel}",
  title="Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages",
  booktitle="2021 44th International Spring Seminar on Electronics Technology (ISSE)",
  year="2021",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  volume="44",
  number="1",
  pages="1--4",
  publisher="IEEE",
  doi="10.1109/ISSE51996.2021.9467519",
  isbn="978-1-6654-1477-7",
  url="https://ieeexplore.ieee.org/document/9467519"
}