Current Load of Thick-film Pastes for Power Applications

Current Load of Thick-film Pastes for Power Applications

Paper in proceedings (conference paper)

This paper deals with the current-carrying capacity of silver cermet thick-film conductors. Ten different patterns of thick-film conductors were created on the alumina substrate (96 % Al 2 O 3 ). The electrical current load concerning the width of the conductive path was determined from the performed measurements. During the measuring process, the electrical current was rising by 0.1A per 10s increasing voltage and temperature. Conductive path widths from 0.20 - 0.65 in 0.05 mm steps were tested. The terminals on the samples were connected by two methods, mechanical and solder joints. Results showed that the thick-film path was working up to 550 °C, with the current load up to approximately 8.6A for mechanically connected terminals. Soldered terminals were loaded by up to 7.1A and its temperature increased to 350 °C. Both results were measured for 0.65 mm path width.

This paper deals with the current-carrying capacity of silver cermet thick-film conductors. Ten different patterns of thick-film conductors were created on the alumina substrate (96 % Al 2 O 3 ). The electrical current load concerning the width of the conductive path was determined from the performed measurements. During the measuring process, the electrical current was rising by 0.1A per 10s increasing voltage and temperature. Conductive path widths from 0.20 - 0.65 in 0.05 mm steps were tested. The terminals on the samples were connected by two methods, mechanical and solder joints. Results showed that the thick-film path was working up to 550 °C, with the current load up to approximately 8.6A for mechanically connected terminals. Soldered terminals were loaded by up to 7.1A and its temperature increased to 350 °C. Both results were measured for 0.65 mm path width.

alumina, ceramic packaging, conductors, electric current, reliability, silver, silver alloys, soldering

alumina, ceramic packaging, conductors, electric current, reliability, silver, silver alloys, soldering

OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.; JANKOVSKÝ, J.

2021

19.06.2020

IEEE

978-1-7281-6773-2

2020 43rd International Spring Seminar on Electronics Technology (ISSE)

2161-2536

Conference proceedings (International Spring Seminar on Electronics Technology)

United States of America

1

6

6

https://ieeexplore.ieee.org/document/9121138