Publication result detail

Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys

OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.

Original Title

Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys

English Title

Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys

Type

Paper in proceedings (conference paper)

Original Abstract

The main aim of this work was to determine and summarize the applicability of etching solutions for the preparation of examined solder joint samples after metallographic cross-sections. Each etchant has different etching rate for every element and compound thereby highlighting various information about the solder joint inner structure. These findings were subsequently used to recommend the choice of a given solution for certain information about the properties of the inner structure of the SAC305 solder joint. Four types of solutions with strong acid were used. The results showed that all etchants could be used for interfacial intermetallic compounds. However, only Etchant A and Etchant D were the most suitable for comprehensive examination of the SAC305 solder ball inner structure.

English abstract

The main aim of this work was to determine and summarize the applicability of etching solutions for the preparation of examined solder joint samples after metallographic cross-sections. Each etchant has different etching rate for every element and compound thereby highlighting various information about the solder joint inner structure. These findings were subsequently used to recommend the choice of a given solution for certain information about the properties of the inner structure of the SAC305 solder joint. Four types of solutions with strong acid were used. The results showed that all etchants could be used for interfacial intermetallic compounds. However, only Etchant A and Etchant D were the most suitable for comprehensive examination of the SAC305 solder ball inner structure.

Keywords

copper alloys, etching, metallography, silver alloys, soldering, solders, tin alloys

Key words in English

copper alloys, etching, metallography, silver alloys, soldering, solders, tin alloys

Authors

OTÁHAL, A.; SKÁCEL, J.; SZENDIUCH, I.

RIV year

2021

Released

19.06.2020

Publisher

IEEE

ISBN

978-1-7281-6773-2

Book

2020 43rd International Spring Seminar on Electronics Technology (ISSE)

ISBN

2161-2536

Periodical

Conference proceedings (International Spring Seminar on Electronics Technology)

State

United States of America

Pages from

1

Pages to

6

Pages count

6

URL

https://ieeexplore.ieee.org/document/9121138

BibTex

@inproceedings{BUT164803,
  author="Alexandr {Otáhal} and Josef {Skácel} and Ivan {Szendiuch}",
  title="Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys",
  booktitle="2020 43rd International Spring Seminar on Electronics Technology (ISSE)",
  year="2020",
  journal="Conference proceedings (International Spring Seminar on Electronics Technology)",
  pages="1--6",
  publisher="IEEE",
  doi="10.1109/ISSE49702.2020.9121138",
  isbn="978-1-7281-6773-2",
  url="https://ieeexplore.ieee.org/document/9121138"
}