Publication result detail

PACKML AND ITS INTEGRATION INTO ABB ROBOT STUDIO FOR HOLONIC MANUFACTURING SYSTEM TESTING

BENEŠL, T.

Original Title

PACKML AND ITS INTEGRATION INTO ABB ROBOT STUDIO FOR HOLONIC MANUFACTURING SYSTEM TESTING

English Title

PACKML AND ITS INTEGRATION INTO ABB ROBOT STUDIO FOR HOLONIC MANUFACTURING SYSTEM TESTING

Type

Paper in proceedings (conference paper)

Original Abstract

This paper describes the possibilities of using PackML standard in ABB Robot Studio for stimulating a holonic manufacturing systems. Using the creation of the functional and animated model in ABB Robot Studio, it is possible to implement PackML standards to this model. Using multiple models, the whole manufacturing process can be simulated, with the aim of testing and de- bugging a holonic manufacturing system control.

English abstract

This paper describes the possibilities of using PackML standard in ABB Robot Studio for stimulating a holonic manufacturing systems. Using the creation of the functional and animated model in ABB Robot Studio, it is possible to implement PackML standards to this model. Using multiple models, the whole manufacturing process can be simulated, with the aim of testing and de- bugging a holonic manufacturing system control.

Keywords

PackML, ABB Robot Studio, holonic manufacturing systems, Industry 4.0, virtual manufacturing, holonic manufacturing systems

Key words in English

PackML, ABB Robot Studio, holonic manufacturing systems, Industry 4.0, virtual manufacturing, holonic manufacturing systems

Authors

BENEŠL, T.

RIV year

2019

Released

25.04.2019

Publisher

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

Location

Brno

ISBN

978-80-214-5735-5

Book

Proceedings of the 25 th Conference STUDENT EEICT 2019

Pages from

546

Pages to

550

Pages count

5

URL

BibTex

@inproceedings{BUT156667,
  author="Tomáš {Benešl}",
  title="PACKML AND ITS INTEGRATION INTO ABB ROBOT STUDIO FOR HOLONIC MANUFACTURING SYSTEM TESTING",
  booktitle="Proceedings of the 25 th Conference STUDENT EEICT 2019",
  year="2019",
  number="1",
  pages="546--550",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií",
  address="Brno",
  isbn="978-80-214-5735-5",
  url="http://www.feec.vutbr.cz/EEICT/archiv/sborniky/EEICT_2019_sbornik.pdf"
}