Publication detail

New trends in packaging

Marek Novotný, Ivan Szendiuch, Cyril Vaško

Original Title

New trends in packaging

Type

conference paper

Language

English

Original Abstract

Tento článek se zabývá novými trendy v pouzdření. Seznamuje nás s technologií výroby a použití pouzder.

Key words in English

System on Package, System in Package, Wafer Level Packaging, Flip Chip

Authors

Marek Novotný, Ivan Szendiuch, Cyril Vaško

RIV year

2005

Released

1. 1. 2005

Publisher

VUT Brno

Location

Brno

ISBN

80-214-2990-9

Book

EDS 05 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS

Edition number

první

Pages from

333

Pages to

337

Pages count

5

BibTex

@inproceedings{BUT15365,
  author="Marek {Novotný} and Ivan {Szendiuch} and Cyril {Vaško}",
  title="New trends in packaging",
  booktitle="EDS 05 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS",
  year="2005",
  volume="1",
  number="první",
  pages="5",
  publisher="VUT Brno",
  address="Brno",
  isbn="80-214-2990-9"
}