Publication result detail

New trends in packaging

Marek Novotný, Ivan Szendiuch, Cyril Vaško

Original Title

New trends in packaging

English Title

New trends in packaging

Type

Paper in proceedings (conference paper)

Original Abstract

Tento článek se zabývá novými trendy v pouzdření. Seznamuje nás s technologií výroby a použití pouzder.

English abstract

This paper describes the new trends in packaging.The packaging is important part of electronics design in light of thermo mechanical properties, better connecting of microelectronics devices or protection from dust and climatic effects. We can define packaging as every technology required between the IC and system.

Key words in English

System on Package, System in Package, Wafer Level Packaging, Flip Chip

Authors

Marek Novotný, Ivan Szendiuch, Cyril Vaško

Released

01.01.2005

Publisher

VUT Brno

Location

Brno

ISBN

80-214-2990-9

Book

EDS 05 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS

Volume

1

Pages from

333

Pages count

5

BibTex

@inproceedings{BUT15365,
  author="Marek {Novotný} and Ivan {Szendiuch} and Cyril {Vaško}",
  title="New trends in packaging",
  booktitle="EDS 05 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS",
  year="2005",
  volume="1",
  number="první",
  pages="5",
  publisher="VUT Brno",
  address="Brno",
  isbn="80-214-2990-9"
}