Detail publikačního výsledku

Life Time of Surface Mount Devices

Marek Novotny, Jindrich Bulva, Ivan Szendiuch

Original Title

Life Time of Surface Mount Devices

English Title

Life Time of Surface Mount Devices

Type

Paper in proceedings (conference paper)

Original Abstract

Cílem práce je zlepšení životnosti pájených SMD součástek, pomocí programu ANSYS. Testovaná struktura je podrobena zkoušce teplotního cyklování v rozmezí od -40 do 120 °C. Dále potom se určí nejvíce namáhané místo v pájeném spoji.

English abstract

The aim of this paper is to improve reliability of SMT connecting and to increase durability of these structures. Three-dimensional finite element analysis has been applied to determine the time-dependent solder joint fatigue response and under accelerated temperature cycling conditions (-40C to +125C, 15min ramps/15min dwells). And definition place with maximal stress value rising in solder joint under shearing and tearing.

Key words in English

SMD, ANSYS, thermomechanical stress

Authors

Marek Novotny, Jindrich Bulva, Ivan Szendiuch

Released

01.01.2005

Publisher

VUT Brno

Location

Brno

ISBN

80-214-2990-9

Book

EDS 05 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS

Volume

1

Pages from

344

Pages count

5

Full text in the Digital Library

http://hdl.handle.net/

BibTex

@inproceedings{BUT15363,
  author="Marek {Novotný} and Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Life Time of Surface Mount Devices",
  booktitle="EDS 05 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS",
  year="2005",
  volume="1",
  number="první",
  pages="5",
  publisher="VUT Brno",
  address="Brno",
  isbn="80-214-2990-9"
}