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MELICHAR, T.; BYDŽOVSKÝ, J.; DUFKA, A.
Original Title
Effect of wood chips properties on mineralogical composition and microstructure of silicate matrix based composites
English Title
Type
Paper in proceedings (conference paper)
Original Abstract
The research presented in this article was focused on proving the effect of wood chips parameters on the hardening process of silicate matrix in cement-bonded particleboard. Namely content of humidity in the chips (in range 30 to 90%) was significant. This amount of humidity was chosen with respect to real conditions of cement-bonded particleboards production. Influence of humidity could be reflected in the content of sugar (cellulose etc.) in wooden chips. The sugars affect the hardening of matrix negatively. Thus, phase composition and microstructure of matrix of cement-bonded particle boards were analysed during 2 to 28 days. Investigation of physico-chemical parameters and microstructure was also supplemented by verification of the basic material characteristics of cement-bonded particleboards (strength and modulus of elasticity in bending, transverse tensile strength perpendicular to the plane of the board, etc.).
English abstract
Keywords
Wood chips; effect; humidity; mineralogical composition; microstructure; silicate matrix; composite.
Key words in English
Authors
RIV year
2019
Released
16.07.2018
Publisher
IOP Publishing
Location
Great Britain
Book
Construmat 2018
ISBN
1757-8981
Periodical
IOP Conference Series: Materials Science and Engineering
Volume
385
Number
1
State
United Kingdom of Great Britain and Northern Ireland
Pages from
Pages to
6
Pages count
URL
http://iopscience.iop.org/article/10.1088/1757-899X/385/1/012035
Full text in the Digital Library
http://hdl.handle.net/11012/137108
BibTex
@inproceedings{BUT149017, author="Tomáš {Melichar} and Jiří {Bydžovský} and Amos {Dufka}", title="Effect of wood chips properties on mineralogical composition and microstructure of silicate matrix based composites", booktitle="Construmat 2018", year="2018", journal="IOP Conference Series: Materials Science and Engineering", volume="385", number="1", pages="1--6", publisher="IOP Publishing", address="Great Britain", doi="10.1088/1757-899X/385/1/012035", issn="1757-8981", url="http://iopscience.iop.org/article/10.1088/1757-899X/385/1/012035" }
Documents
00_paper final - Melichar_2018_IOP_Conf._Ser.__Mater._Sci._Eng._385_012035