Publication result detail

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

BULVA, J., NOVOTNÝ, M., SZENDIUCH, I.

Original Title

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

English Title

Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling

Type

Paper in proceedings (conference paper)

Original Abstract

This paper describes theory of solder joint reliability and thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.

English abstract

This paper describes theory of solder joint reliability and thermomechanical modelling of connection of two different materials, which are often used in electronic devices – organics FR4 and two ceramics material Al2O3 and AlN. There are investigated combinations organic-organic, organic-ceramic, ceramic-ceramic, connected with eutectic SnPb solder or lead free solder SnAgCu.

Key words in English

ANSYS, modelling, reliability, Lead-free

Authors

BULVA, J., NOVOTNÝ, M., SZENDIUCH, I.

Released

01.01.2005

Publisher

IMAPS BENELUX

Location

Brugge, Belgium

Book

15th European Microelectronics and Packaging Conference & Exhibition

Pages from

546

Pages count

550

BibTex

@inproceedings{BUT14828,
  author="Jindřich {Bulva} and Marek {Novotný} and Ivan {Szendiuch}",
  title="Investigation of Lead-Free Solder Joints Reliability by Thermal Modelling",
  booktitle="15th European Microelectronics and Packaging Conference & Exhibition",
  year="2005",
  pages="550",
  publisher="IMAPS BENELUX",
  address="Brugge, Belgium"
}