Detail publikačního výsledku

Thermomechanical stressing of microelectronics structures

Novotný, M., Bulva, J., Szendiuch, I.

Original Title

Thermomechanical stressing of microelectronics structures

English Title

Thermomechanical stressing of microelectronics structures

Type

Paper in proceedings (conference paper)

Original Abstract

Termomechanical stressing microeletronics structure

English abstract

Termomechanical stressing microeletronics structure

Keywords

Stress, ANSYS, life time, strain

Key words in English

Stress, ANSYS, life time, strain

Authors

Novotný, M., Bulva, J., Szendiuch, I.

Released

01.01.2005

Publisher

IMAPS BENELUX

Location

Brugge

ISBN

00-000-0000-0

Book

Proceedings EMPC 2005

Volume

1

Pages from

513

Pages count

4

Full text in the Digital Library

http://hdl.handle.net/

BibTex

@inproceedings{BUT14676,
  author="Marek {Novotný} and Ivan {Szendiuch} and Jindřich {Bulva}",
  title="Thermomechanical stressing of microelectronics structures",
  booktitle="Proceedings EMPC 2005",
  year="2005",
  volume="1",
  number="první",
  pages="4",
  publisher="IMAPS BENELUX",
  address="Brugge",
  isbn="00-000-0000-0"
}