Publication result detail

Developement of a test environment for the measurement of mechanical stress in packaged integrated circuits

Zdenek Barton, Jiri Horky, Jozef Vanneuville, Dorine Gevaert

Original Title

Developement of a test environment for the measurement of mechanical stress in packaged integrated circuits

English Title

Developement of a test environment for the measurement of mechanical stress in packaged integrated circuits

Type

Paper in proceedings (conference paper)

Original Abstract

Due to thermal and mechanical loading during manufacturing of integrated curcuits, stress is produced on the silicon chip. The equipment described allows in depth study of the stress and is used during developementof new methodologies of packaging.

English abstract

Due to thermal and mechanical loading during manufacturing of integrated curcuits, stress is produced on the silicon chip. The equipment described allows in depth study of the stress and is used during developementof new methodologies of packaging.

Key words in English

mechanical stress, reliability, packages, intergated ciruits

Authors

Zdenek Barton, Jiri Horky, Jozef Vanneuville, Dorine Gevaert

Released

01.01.2003

Location

Brno

ISBN

80-214-2452-4

Book

Proceedings of the 10th Electronic Devices and Systems Conference EDS 2003

Volume

2003

Pages from

1

Pages count

5

BibTex

@inproceedings{BUT14339,
  author="Zdeněk {Bartoň}",
  title="Developement of a test environment for the measurement of mechanical stress in packaged integrated circuits",
  booktitle="Proceedings of the 10th Electronic Devices and Systems Conference EDS 2003",
  year="2003",
  volume="2003",
  pages="5",
  address="Brno",
  isbn="80-214-2452-4"
}