Publication result detail

INVESTIGATION OF INFLUENCE NITROGEN ATMOSPHERE ON THE SPREADABILITY AND RELIABILITY OF SOLDER JOINTS

VALA, M.

Original Title

INVESTIGATION OF INFLUENCE NITROGEN ATMOSPHERE ON THE SPREADABILITY AND RELIABILITY OF SOLDER JOINTS

English Title

INVESTIGATION OF INFLUENCE NITROGEN ATMOSPHERE ON THE SPREADABILITY AND RELIABILITY OF SOLDER JOINTS

Type

Paper in proceedings (conference paper)

Original Abstract

This article examines the impact of nitrogen atmosphere on the quality of the solder joint. For tests were used two lead-free solder pastes, specifically SAC305 and SN100C. These pastes were printed on a substrate FR4 with ENIG finish with semiautomatic devices. For reflow of paste was used specially modified desiccator. This device has hot plate with the cooling system. This system is active after reflow. In this device, it was possible to create around the solder paste a nitrogen atmosphere having defined content of residual oxygen. This experiment determined the most appropriate concentration of the protective gas atmosphere to obtain the greatest wettability and spreadability of paste, which is a prerequisite for a good solder joint.

English abstract

This article examines the impact of nitrogen atmosphere on the quality of the solder joint. For tests were used two lead-free solder pastes, specifically SAC305 and SN100C. These pastes were printed on a substrate FR4 with ENIG finish with semiautomatic devices. For reflow of paste was used specially modified desiccator. This device has hot plate with the cooling system. This system is active after reflow. In this device, it was possible to create around the solder paste a nitrogen atmosphere having defined content of residual oxygen. This experiment determined the most appropriate concentration of the protective gas atmosphere to obtain the greatest wettability and spreadability of paste, which is a prerequisite for a good solder joint.

Keywords

Solder reflow, nitrogen, modified atmosphere, lead – free, quality of the solder joint, temperature profile.

Key words in English

Solder reflow, nitrogen, modified atmosphere, lead – free, quality of the solder joint, temperature profile.

Authors

VALA, M.

RIV year

2018

Released

27.04.2017

Publisher

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních

Location

Brno

ISBN

978-80-214-5496-5

Book

Proceedings of the 23nd Conference STUDENT EEICT 2017

Pages from

547

Pages to

551

Pages count

5

URL

http://eeict.feec.vutbr.cz/?page_id=198

BibTex

@inproceedings{BUT135260,
  author="Martin {Vala}",
  title="INVESTIGATION OF INFLUENCE NITROGEN ATMOSPHERE ON THE SPREADABILITY AND RELIABILITY OF SOLDER JOINTS",
  booktitle="Proceedings of the 23nd Conference STUDENT EEICT 2017",
  year="2017",
  number="první",
  pages="547--551",
  publisher="Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních",
  address="Brno",
  isbn="978-80-214-5496-5",
  url="http://eeict.feec.vutbr.cz/?page_id=198"
}