Publication result detail

Microscopic Analysis of Chips

MALČÍK, D.; DRAHANSKÝ, M.

Original Title

Microscopic Analysis of Chips

English Title

Microscopic Analysis of Chips

Type

WoS Article

Original Abstract

Nowadays many different types of chips are used virtually everywhere in the real world. Sometimes, it is necessary to ensure that a certain chip meets specific requirements. For this reason, it is essential to examine various properties of chips; one of those can be, e.g., the chip security with respect to its physical structure.

This paper contains an overview of methods for processing of chips - concretely: chip decapsulation, chip deprocessing, scanning of layers, microscopic analysis and image data analysis.

English abstract

Nowadays many different types of chips are used virtually everywhere in the real world. Sometimes, it is necessary to ensure that a certain chip meets specific requirements. For this reason, it is essential to examine various properties of chips; one of those can be, e.g., the chip security with respect to its physical structure.

This paper contains an overview of methods for processing of chips - concretely: chip decapsulation, chip deprocessing, scanning of layers, microscopic analysis and image data analysis.

Keywords

chip, analysis, microscopic, microscope, decapsulation, deprocessing.

Key words in English

chip, analysis, microscopic, microscope, decapsulation, deprocessing.

Authors

MALČÍK, D.; DRAHANSKÝ, M.

RIV year

2017

Released

10.11.2016

ISBN

1738-9976

Periodical

International Journal of Security and Its Applications

Volume

2016

Number

11

State

Republic of Korea

Pages from

47

Pages to

66

Pages count

20

URL

BibTex

@article{BUT134020,
  author="Dominik {Malčík} and Martin {Drahanský}",
  title="Microscopic Analysis of Chips",
  journal="International Journal of Security and Its Applications",
  year="2016",
  volume="2016",
  number="11",
  pages="47--66",
  doi="10.14257/ijsia.2016.10.11.05",
  issn="1738-9976",
  url="http://www.sersc.org/journals/IJSIA/vol10_no11_2016/5.pdf"
}

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