Publication result detail

Cleaning of Electronic Assemblies - a Modular Approach

SZENDIUCH, I.

Original Title

Cleaning of Electronic Assemblies - a Modular Approach

English Title

Cleaning of Electronic Assemblies - a Modular Approach

Type

Paper in proceedings (conference paper)

Original Abstract

Cleaning process and its importance in electronics is described and studied, one of solutions is modular approach

English abstract

Cleaning process and its importance in electronics is described and studied, one of solutions is modular approach

Keywords

Cleaning, inpurities

Key words in English

Cleaning, inpurities

Authors

SZENDIUCH, I.

Released

16.06.2004

Publisher

IMAPS

Location

Praha

ISBN

80-239-2835-X

Book

Proceedings of 3rd European Microelectronics and Packaging

Volume

2004

Pages from

305

Pages count

6

BibTex

@inproceedings{BUT12643,
  author="Ivan {Szendiuch}",
  title="Cleaning of Electronic Assemblies - a Modular Approach",
  booktitle="Proceedings of 3rd European Microelectronics and Packaging",
  year="2004",
  volume="2004",
  number="první",
  pages="6",
  publisher="IMAPS",
  address="Praha",
  isbn="80-239-2835-X"
}