Publication result detail

Investigation of Creep and Stress Relaxation of Lead-free Solder Joints

SZENDIUCH, I.

Original Title

Investigation of Creep and Stress Relaxation of Lead-free Solder Joints

English Title

Investigation of Creep and Stress Relaxation of Lead-free Solder Joints

Type

Paper in proceedings (conference paper)

Original Abstract

Investigation of lead-free solders by mechanical tests (creep and stress). Comparation of SnAg, SnAgCu with SnPb.

English abstract

Investigation of lead-free solders by mechanical tests (creep and stress). Comparation of SnAg, SnAgCu with SnPb.

Key words in English

lead free soldering, ageing, reliability

Authors

SZENDIUCH, I.

Released

14.11.2004

Publisher

IMAPS USA

Location

Long Beach

ISBN

0-930815-74-2

Book

37th IMAPS Symposium on Microelectronics

Pages from

1-10

Pages count

10