Publication result detail

Measurement Setup for Identifying Parameters of the Encapsulated Bond Wires

PETRŽELA, J.; ŠOTNER, R.; GÖTTHANS, T.; DŘÍNOVSKÝ, J.; KRATOCHVÍL, T.; WIEERS, A.

Original Title

Measurement Setup for Identifying Parameters of the Encapsulated Bond Wires

English Title

Measurement Setup for Identifying Parameters of the Encapsulated Bond Wires

Type

Paper in proceedings (conference paper)

Original Abstract

This short paper describes the experimental measurement setup for extraction of dynamical parameters of the encapsulated bond wires. Based on the proposed method a current carrying capability as well as fatigue process can be quantified and statistically evaluated. The integrated circuits with bonding wires and Kelvin probes were fabricated by ON Semiconductor Company in Belgium.

English abstract

This short paper describes the experimental measurement setup for extraction of dynamical parameters of the encapsulated bond wires. Based on the proposed method a current carrying capability as well as fatigue process can be quantified and statistically evaluated. The integrated circuits with bonding wires and Kelvin probes were fabricated by ON Semiconductor Company in Belgium.

Keywords

Electronic system, power supplies, precision measurement, switching networks.

Key words in English

Electronic system, power supplies, precision measurement, switching networks.

Authors

PETRŽELA, J.; ŠOTNER, R.; GÖTTHANS, T.; DŘÍNOVSKÝ, J.; KRATOCHVÍL, T.; WIEERS, A.

RIV year

2017

Released

01.01.2016

Publisher

IFAC-PapersOnLine, ScienceDirect - Elsevier

Location

Nizozemsko

ISBN

978-3-901608-46-9

Book

8th Vienna International Conference on Mathematical Modelling, MATHMOD 2015

ISBN

2405-8963

Periodical

IFAC-PapersOnLine

Volume

48

Number

1

State

United Kingdom of Great Britain and Northern Ireland

Pages from

936

Pages to

937

Pages count

2

URL

http://ac.els-cdn.com/S2405896315001470/1-s2.0-S2405896315001470-main.pdf?_tid=cfe36658-c4e6-11e5-92f5-00000aacb361&acdnat=1453893311_fc70679186d2c8e433e81eb998b14555

BibTex

@inproceedings{BUT121250,
  author="Jiří {Petržela} and Roman {Šotner} and Tomáš {Götthans} and Jiří {Dřínovský} and Tomáš {Kratochvíl} and Aarnout {Wieers}",
  title="Measurement Setup for Identifying Parameters of the Encapsulated Bond Wires",
  booktitle="8th Vienna International Conference on Mathematical Modelling, MATHMOD 2015",
  year="2016",
  journal="IFAC-PapersOnLine",
  volume="48",
  number="1",
  pages="936--937",
  publisher="IFAC-PapersOnLine, ScienceDirect - Elsevier",
  address="Nizozemsko",
  doi="10.1016/j.ifacol.2015.05.146",
  isbn="978-3-901608-46-9",
  issn="2405-8971",
  url="http://ac.els-cdn.com/S2405896315001470/1-s2.0-S2405896315001470-main.pdf?_tid=cfe36658-c4e6-11e5-92f5-00000aacb361&acdnat=1453893311_fc70679186d2c8e433e81eb998b14555"
}