Change of the thermal profile in the modern MCCB by the different electrical contact resistance

Change of the thermal profile in the modern MCCB by the different electrical contact resistance

Scopus Article

The paper deals with the change of temperature rise of the MCCB at the steady state. The critical parts under the study are main contacts and contact lever. The movable contact in focus is modern, rotoactive system which moves contact along a circular path and his material is harder than the fixed one. It causes sequential sag of the movable contact followed by a deformation of the fixed one. Consequently, the contact area between the pair of contacts is increasing, but the contact material is losing during the arc quenching. Rests and dirt layers appear on the contact surfaces and causes increase electric and thermal resistances between contacts. Temperature rise of the device with additive layers after arcing increases against new one at the steady state. The profile of the temperature rises are computed using finite volume method (FVM). The first part of the paper focuses on the calculation of the thermal losses of the electrical current path at rated current with the different electrical contact resistance.

The paper deals with the change of temperature rise of the MCCB at the steady state. The critical parts under the study are main contacts and contact lever. The movable contact in focus is modern, rotoactive system which moves contact along a circular path and his material is harder than the fixed one. It causes sequential sag of the movable contact followed by a deformation of the fixed one. Consequently, the contact area between the pair of contacts is increasing, but the contact material is losing during the arc quenching. Rests and dirt layers appear on the contact surfaces and causes increase electric and thermal resistances between contacts. Temperature rise of the device with additive layers after arcing increases against new one at the steady state. The profile of the temperature rises are computed using finite volume method (FVM). The first part of the paper focuses on the calculation of the thermal losses of the electrical current path at rated current with the different electrical contact resistance.

MCCB, temperature profile, thermal losses, Solidworks FlowSimulation

MCCB, temperature profile, thermal losses, Solidworks FlowSimulation

DOSTÁL, L.; DOHNAL, P.; VALENTA, J.

2016

01.09.2015

2336-2626

Plasma Physics and Technology

2

3

Czech Republic

312

315

4

http://ppt.fel.cvut.cz/articles/2015/dostal.pdf