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VALA, R.; ŘIHÁK, P.; SZENDIUCH, I.
Original Title
Influence of Flux throughout Reflow Process on FBGA Solder Balls
English Title
Type
Paper in proceedings (conference paper)
Original Abstract
The paper is focused on influence of flux during reflow process. Smaller and lighter FBGA packages caused formation of defects. Analysis of proper soldering process of FBGA components is crucial for correct function of a device. Detection of defects after reflow process is an important part of solder joints reliability. This paper deals with particular parameters which affected yield of FBGA rework process.
English abstract
Keywords
FBGA, solder alloy, flux, X-Ray.
Key words in English
Authors
RIV year
2016
Released
06.05.2015
Publisher
Budapest University of Technology and Economics
Location
Hungary
ISBN
978-963-313-177-0
Book
Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology
Pages from
250
Pages to
254
Pages count
5
URL
https://ieeexplore.ieee.org/document/7248000
BibTex
@inproceedings{BUT117451, author="Radek {Vala} and Pavel {Řihák} and Ivan {Szendiuch}", title="Influence of Flux throughout Reflow Process on FBGA Solder Balls", booktitle="Novel Trends in Electronic Manufacturing - Book of Abstracts 38th International Spring Seminar on Electronics Technology", year="2015", pages="250--254", publisher="Budapest University of Technology and Economics", address="Hungary", doi="10.1109/ISSE.2015.7248000", isbn="978-963-313-177-0", url="https://ieeexplore.ieee.org/document/7248000" }