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SZENDIUCH, I.; HEJÁTKOVÁ, E.
Original Title
Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education
English Title
Type
Conference proceedings
Original Abstract
This paper deals with innovative education programme in the microelectronics technology area, containing modern technologies of electronic packaging and interconnection. It is applied at Faculty of Electrical Engineering and Communication in Brno University of Technology.
English abstract
Keywords
Engineering education, Microelectronics, Electronics hardware, Interdisciplinary subject
Key words in English
Authors
RIV year
2016
Released
20.07.2015
Publisher
MATE Ltd., Zagreb
Location
Zagreb
ISBN
978-953-246-232-6
Book
International Conference on Engineering Education - New Technologies and Innovation for Global Business
Edition
1
NEUVEDENO
Pages from
451
Pages to
457
Pages count
7
BibTex
@proceedings{BUT115458, editor="Ivan {Szendiuch} and Edita {Hejátková}", title="Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Innovation in Microelectronics Assembly Technology Education", year="2015", series="1", number="1", pages="451--457", publisher="MATE Ltd., Zagreb", address="Zagreb", isbn="978-953-246-232-6" }