Publication result detail

Optimizing of Solder Joint Reliability by 3D Modeling

BULVA, J., SZENDIUCH, I.

Original Title

Optimizing of Solder Joint Reliability by 3D Modeling

English Title

Optimizing of Solder Joint Reliability by 3D Modeling

Type

Paper in proceedings (conference paper)

Original Abstract

This article is focused on thermo-mechanical modelling of solder joint between two materials with different CTE, which are commonly used in many today’s electronic devices. There are investigated various materials including most common combination FR4 and 96% Al2O3 ceramic materials. The substrates are connected with lead free solder composition SnAgCu. ANSYS software is applied and results from several analyse combinations are discussed. One of the main purposes is a comparison of thermo-mechanical properties such as stress and strain that can creates in MSMs, when lead free solder bumps changed their dimensions and shape by thermal loading.

English abstract

This article is focused on thermo-mechanical modelling of solder joint between two materials with different CTE, which are commonly used in many today’s electronic devices. There are investigated various materials including most common combination FR4 and 96% Al2O3 ceramic materials. The substrates are connected with lead free solder composition SnAgCu. ANSYS software is applied and results from several analyse combinations are discussed. One of the main purposes is a comparison of thermo-mechanical properties such as stress and strain that can creates in MSMs, when lead free solder bumps changed their dimensions and shape by thermal loading.

Key words in English

solder joint reliability, modelling, ANSYS

Authors

BULVA, J., SZENDIUCH, I.

Released

01.01.2004

Publisher

IMAPS CZ&SK Chapter

Location

Lanskroun

ISBN

80-239-2835-X

Book

Proceedings of 3rd Microelectronics and Packaging Symposium with Table Top Exhibition

Pages from

195

Pages count

200

BibTex

@inproceedings{BUT10966,
  author="Jindřich {Bulva} and Ivan {Szendiuch}",
  title="Optimizing of Solder Joint Reliability by 3D Modeling",
  booktitle="Proceedings of 3rd Microelectronics and Packaging Symposium with Table Top Exhibition",
  year="2004",
  pages="200",
  publisher="IMAPS CZ&SK Chapter",
  address="Lanskroun",
  isbn="80-239-2835-X"
}