Publication detail

Mechanical testing of PCB using computer simulations

OTÁHAL, A. SZENDIUCH, I. PSOTA, B.

Original Title

Mechanical testing of PCB using computer simulations

English Title

Mechanical testing of PCB using computer simulations

Type

conference paper

Language

Czech

Original Abstract

This paper deals with the usage of the computer simulation for the mechanical testing of the PCB's to obtain optimal configuration for mechanical reliability. The main target is to determine factors that are the most important role for this kind of analysis. For this purpose sensitive analysis were made and following critical data were defined. The critical step is to determinate correct material data as well as properties of the board including its attachment.

English abstract

This paper deals with the usage of the computer simulation for the mechanical testing of the PCB's to obtain optimal configuration for mechanical reliability. The main target is to determine factors that are the most important role for this kind of analysis. For this purpose sensitive analysis were made and following critical data were defined. The critical step is to determinate correct material data as well as properties of the board including its attachment.

Keywords

circuit reliability, electronic engineering computing, mechanical testing, printed circuit testing

Key words in English

circuit reliability, electronic engineering computing, mechanical testing, printed circuit testing

Authors

OTÁHAL, A.; SZENDIUCH, I.; PSOTA, B.

RIV year

2014

Released

20. 8. 2014

Publisher

IEEE

Location

Dresden

ISBN

978-1-4799-4455-2

Book

37th Int. Spring Seminar on Electronics Technology

Pages from

290

Pages to

293

Pages count

495

BibTex

@inproceedings{BUT109637,
  author="Alexandr {Otáhal} and Ivan {Szendiuch} and Boleslav {Psota}",
  title="Mechanical testing of PCB using computer simulations",
  booktitle="37th Int. Spring Seminar on Electronics Technology",
  year="2014",
  volume="2014",
  number="37",
  pages="290--293",
  publisher="IEEE",
  address="Dresden",
  doi="10.1109/ISSE.2014.6887610",
  isbn="978-1-4799-4455-2"
}