Publication result detail

Electrochemical Deposition of Tin and Silicon Studied by EQCM

KAVÁLEK, O.; VONDRÁK, J.; SEDLAŘÍKOVÁ, M.

Original Title

Electrochemical Deposition of Tin and Silicon Studied by EQCM

English Title

Electrochemical Deposition of Tin and Silicon Studied by EQCM

Type

Paper in proceedings (conference paper)

Original Abstract

Silicon and Tin thin films were prepared by electrochemical deposition on copper and nickel substrates in the Atmosbag. Electrochemical activity is described by cyclic voltammetry and for studying increase of weight were used EQCM. Deposited layers were studied by optic microscopy, electron microscopy and X-ray diffraction

English abstract

Silicon and Tin thin films were prepared by electrochemical deposition on copper and nickel substrates in the Atmosbag. Electrochemical activity is described by cyclic voltammetry and for studying increase of weight were used EQCM. Deposited layers were studied by optic microscopy, electron microscopy and X-ray diffraction

Keywords

deposition, Tin, Silicon

Key words in English

deposition, Tin, Silicon

Authors

KAVÁLEK, O.; VONDRÁK, J.; SEDLAŘÍKOVÁ, M.

RIV year

2017

Released

02.01.2014

Publisher

ECS

Location

USA

ISBN

978-1-60768-383-4

Book

13th International Conference on Advanced Batteries, Accumulators and Fuel Cells (ABAF)

ISBN

1938-5862

Periodical

ECS Transactions

Volume

2014

Number

48

State

United States of America

Pages from

17

Pages to

22

Pages count

6

BibTex

@inproceedings{BUT109057,
  author="Ondřej {Kaválek} and Jiří {Vondrák} and Marie {Sedlaříková}",
  title="Electrochemical Deposition of Tin and Silicon Studied by EQCM",
  booktitle="13th International Conference on Advanced Batteries, Accumulators and Fuel Cells (ABAF)",
  year="2014",
  journal="ECS Transactions",
  volume="2014",
  number="48",
  pages="17--22",
  publisher="ECS",
  address="USA",
  doi="10.1149/04801.0017ecst",
  isbn="978-1-60768-383-4",
  issn="1938-5862"
}