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KLÍMA, M.; SOMER, J.; BLAHOVÁ, L.; PROCHÁZKA, M.; SZENDIUCH, I.
Original Title
Usage of Low-Temperature Co-Fired Ceramic In Hermetic Packaging
English Title
Type
Conference proceedings
Original Abstract
This article deals with usage of low-temperature co-fired ceramic as a material for hermetic package of bare-dies. Two types of substrates are measured – Heraeus HeraLock2000 and DuPont GreenTape 951PT. For more accurate results, different arrays of vias are designed to imitate conductive joints in a package. An air-tightness of samples is determined based on Oxygen Transmission Rate measurement. Dependence of the air-tightness on a material thickness and on a count of vias was investigated. Design and fabrication of the samples and measurement description is also included. Results of this experiment compare mentioned types of ceramics and create a base of knowledge for design of an air-tight package.
English abstract
Keywords
LTCC, hermetic packaging, OTR
Key words in English
Authors
Released
20.08.2014
ISBN
978-3-934142-49-7
Book
Advances in Electronic System Integration - Book of Abtracts 37th International Spring Seminar on Electronics Technology
Pages from
99
Pages to
103
Pages count
5
BibTex
@proceedings{BUT108117, editor="Martin {Klíma} and Jakub {Somer} and Lucie {Janů} and Michal {Procházka} and Ivan {Szendiuch}", title="Usage of Low-Temperature Co-Fired Ceramic In Hermetic Packaging", year="2014", pages="99--103", doi="10.1109/ISSE.2014.6887571", isbn="978-3-934142-49-7" }