Publication detail

Finite element modelling of the solder connections for the research project A7.11 - Part 2

ŠEVEČEK, O.

Original Title

Finite element modelling of the solder connections for the research project A7.11 - Part 2

Type

summary research report - contract. research

Language

English

Original Abstract

Development of the ANSYS postprocessing routines in APDL language for the assessment of the critical locations in the solder joint (taking into account the whole loading history of the solder connection); Preparation of the simulation models for the tensile test of the bi-polar connection with the aim to substitute thermal tests and subsequent design of the suitable boundary conditions for the tensile tests and their verification using FE simulations.

Keywords

FE model, solder joint, creep behaviour, tensile test

Authors

ŠEVEČEK, O.

Released

21. 11. 2013

Pages count

22

BibTex

@misc{BUT106209,
  author="Oldřich {Ševeček}",
  title="Finite element modelling of the solder connections for the research project A7.11 - Part 2",
  year="2013",
  pages="22",
  note="summary research report - contract. research"
}