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Publication result detail
VLACH, R.
Original Title
Coupled Thermal-Structural Transient Analysis of Pressure Sensors
English Title
Type
Paper in proceedings (conference paper)
Original Abstract
This paper describes computational simulation of coupled analysis of pressure sensors during passage through the furnace. This analysis should show residual stress that is the problem for the next operation as pressure sensor. The software ANSYS/Workbanch was used for coupled thermal-stress analyses. The goal of the project is determination if the residual stress cause by temperature rise in the furnace has a significant impact on pressure sensor accuracy.
English abstract
Keywords
thermal stress analysis, senzors
Key words in English
Authors
RIV year
2014
Released
07.10.2013
ISBN
978-3-319-02293-2
Book
Mechatronics 2013
Pages from
495
Pages to
501
Pages count
7
BibTex
@inproceedings{BUT104973, author="Radek {Vlach}", title="Coupled Thermal-Structural Transient Analysis of Pressure Sensors", booktitle="Mechatronics 2013", year="2013", pages="495--501", isbn="978-3-319-02293-2" }