Publication result detail

The Use of Computer Simulation in the Electronic Packaging Process

PSOTA, B.; BURŠÍK, M.; SZENDIUCH, I.

Original Title

The Use of Computer Simulation in the Electronic Packaging Process

English Title

The Use of Computer Simulation in the Electronic Packaging Process

Type

Peer-reviewed article not indexed in WoS or Scopus

Original Abstract

This paper deals with the use of the computer simulation for semiconductor chip attach investigation, where the wire bonding is the mostly used process. The main focus lays on the correct definition of the capillary trace, which is essential for creation of a good bond contact as for chip, as well for package or substrate pad. Several simulations for different shapes of loops were created and compared with real bonds, which were done based on the settings from the analysis.

English abstract

This paper deals with the use of the computer simulation for semiconductor chip attach investigation, where the wire bonding is the mostly used process. The main focus lays on the correct definition of the capillary trace, which is essential for creation of a good bond contact as for chip, as well for package or substrate pad. Several simulations for different shapes of loops were created and compared with real bonds, which were done based on the settings from the analysis.

Keywords

ANSYS Workbench, Chip Connection, Simulation, Wirebonding

Key words in English

ANSYS Workbench, Chip Connection, Simulation, Wirebonding

Authors

PSOTA, B.; BURŠÍK, M.; SZENDIUCH, I.

RIV year

2014

Released

18.11.2013

Publisher

Trans Tech Publications

Location

Switzerland

ISBN

1013-9826

Periodical

Key Engineering Materials (print)

Volume

2014

Number

592-593

State

Swiss Confederation

Pages from

201

Pages to

204

Pages count

4

BibTex

@article{BUT104295,
  author="Boleslav {Psota} and Martin {Buršík} and Ivan {Szendiuch}",
  title="The Use of Computer Simulation in the Electronic Packaging Process",
  journal="Key Engineering Materials (print)",
  year="2013",
  volume="2014",
  number="592-593",
  pages="201--204",
  doi="10.4028/www.scientific.net/KEM.592-593.201",
  issn="1013-9826"
}