Publication result detail

The Use of Computer Simulation in the Electronic Packaging Process

PSOTA, B.; BURŠÍK, M.; SZENDIUCH, I.

Original Title

The Use of Computer Simulation in the Electronic Packaging Process

English Title

The Use of Computer Simulation in the Electronic Packaging Process

Type

Abstract

Original Abstract

This paper deals with the problem of the wirebonding process, which is modeled in the simulation process for prediction of the final loop shape. The creation of the virtual model and its evaluation is described.

English abstract

This paper deals with the problem of the wirebonding process, which is modeled in the simulation process for prediction of the final loop shape. The creation of the virtual model and its evaluation is described.

Keywords

Simulation, Wirebonding, Ansys

Key words in English

Simulation, Wirebonding, Ansys

Authors

PSOTA, B.; BURŠÍK, M.; SZENDIUCH, I.

RIV year

2014

Released

01.07.2013

Location

Brno, Česká republika

ISBN

978-80-214-4739-4

Book

Materials Structure & Micromechanics of Fracture

Pages from

182

Pages to

182

Pages count

1

BibTex

@misc{BUT104293,
  author="Boleslav {Psota} and Martin {Buršík} and Ivan {Szendiuch}",
  title="The Use of Computer Simulation in the Electronic Packaging Process",
  booktitle="Materials Structure & Micromechanics of Fracture",
  year="2013",
  pages="182--182",
  address="Brno, Česká republika",
  isbn="978-80-214-4739-4",
  note="Abstract"
}